There are many kinds of sputtering targets with high purity requirements, and they are also widely used in the industry. Today, we will talk about the four types of sputtering targets commonly used in four major fields: high-purity aluminum targets, titanium targets, tantalum targets, and tungsten titanium targets. They cover the fields of flat panel displays, semiconductors, storage, and solar cells.
Aluminum target (stock purity 99.99% - 99.999%)
High-purity aluminum and its alloys are one of the widely used conductive film materials. In its application field, the fabrication of VLSI chips requires a very high purity of sputtering target metal, usually as high as 99.9995%, while the metal purity of flat panel displays and solar cells is slightly lower.
Titanium target (stock purity 99.99% - 99.999%)
Titanium is one of the barrier film materials commonly used in VLSI chips (the corresponding conductive layer material is aluminum). The titanium target will be used together with the titanium ring in the pre-chip manufacturing process. The main function is to assist the sputtering process of titanium targets, which is mainly used in the field of VLSI chip manufacturing.
Tantalum target (inventory purity 99%, 99.5%, 99.9%, 99.995%, 99.99%, 99.995%, 99.999%)
With the explosive growth of demand for consumer electronic products such as smartphones and tablets, the demand for high-end chips has increased significantly, and tantalum has become a hot mineral resource. However, due to the scarcity of tantalum resources, high-purity tantalum targets are expensive and mainly used in large-scale integrated circuits and other fields.
Titanium tungsten target (99.95% purity in stock)
Tungsten titanium alloy has low electron mobility, stable thermal mechanical properties, good corrosion resistance, and good chemical stability. In recent years, tungsten titanium alloy sputtering target has been used as the contact layer material of semiconductor chip grid circuits. Additionally, in the metal connection of semiconductor devices, tungsten and titanium targets can be used as barrier layers. It is used in high-temperature environments, mainly for VLSI and solar cells.
