Titanium sputtering target delivery to customer on 13th of Dec
Product name Titanium round target
Grade Gr1 Gr2 Gr3 Gr5 (Ti6al4v)
Standard titanium target: technical conditions: comply with ASTM B34897
Titanium plate target: technical conditions: conform to ASTM B265-93
Specification: common specification: 60/65/95/100 * 30/32/40/45mm
Plate target: (8-25mm * (150-300) mm * (1000-2500) mm
Tube target: 70mm * 7mm/10mm
Surface polishing can be threaded
Features: Lightweight, excellent corrosion resistance, corrosion resistance, high strength, good heat resistance, good ductility, non-toxic, non-magnetic, excellent mechanical strength, etc.
State Annealing state (M) Hot working state (R) Cold working state (Y) (annealing, ultrasonic flaw detection)
Applications: Used in semiconductor separation devices, flat panel displays, storage electrode films, sputtering coatings, workpiece surface coatings, glass coating industry
Purity is one of the main performance indicators of titanium targets because the purity of the target has a great impact on the performance of the film. However, in practical applications, the requirements for the purity of the target are also different. Silicon chips now range in size from 6 inches to 8 inches to 12 inches, and wiring widths have shrunk from 0.5 um to 0.25 um, 0.18 um, or even 0.13 um, thanks to the microelectronics industry's quick progress. Previously, 99.995% of the target purity can meet the process requirements of 0.35 um IC, while 99.999% or even 99.9999% of the target purity is required for the preparation of 0.18 um lines.
The primary sources of pollution for the deposited films are impurities in the target solid and oxygen and water vapor in the pores. Different target materials have different requirements for different impurity content. For example, pure aluminum and aluminum alloy targets used in the semiconductor industry have special requirements for alkali metal content and radioactive element content.
The target is typically required to have a high density in order to decrease the porosity in the target solid and enhance the performance of the sputtered film. The electrical and optical characteristics of the film are also impacted by the target density in addition to the sputtering rate. The film performs better the greater the target density. Additionally, the target may survive the heat stress during the sputtering process better by becoming denser and stronger. The density is also one of the key performance indicators of the target.
