Phase I:Early chip foundries had high profit margins. They mainly use 100-150mm magnetron sputtering machines with low power.The sputtering film is thick and the chip size is large.
At that time, titanium targets for integrated circuits were mainly 100-150mm monomer and composite targets.
Phase Ⅱ:
In the second stage, according to Moore's law, the chip line width becomes narrower. In order to increase profits, the chip foundry increased the sputtering power of the equipment, mainly using 150-200mm sputtering equipment. This requires increasing the size of the target while maintaining high thermal conductivity, low price, and certain strength. During this period, titanium targets are mainly composed of diffusion welding of aluminum alloy backplane and brazing and welding of copper alloy backplane.
Phase III :
In the third stage, with the development of integrated circuits, the width of chip lines is further narrowed. At this time, chip foundries mainly use 200-300mm sputtering machines, and the requirements for target materials are more stringent. During this period, the Ti target is mainly made of copper alloy backplate diffusion welding.
