1. Purity
The purity of the sputtering target should be at least 99.95%. The higher the purity, the better the performance of the sputtered film.
2. Density
The relative density of the sputtering target should be more than 98%. The target with higher density can reduce the splashing of film particles during the coating process, thus improving the quality of the film.
3. Grain structure
Molybdenum sputtering target is a polycrystalline structure. During sputtering, the target atoms are easily sputtered out along the most closely arranged direction of the hexagonal atoms. In order to achieve the maximum sputtering rate, it is necessary to increase the sputtering rate by changing the crystal structure of the target.
4. Grain size
The grain size can range from microns to millimeters. The sputtering rate of the target with the fine grain is faster than that of the target with coarse grain, and the thickness distribution of the deposited film is also relatively uniform for the target with a small grain size difference.
5. Binding of target and chassis
Before sputtering, the target should be connected to the oxygen-free copper chassis to ensure that the thermal conductivity between the target and the chassis is good. After binding, ultrasonic inspection shall be conducted to ensure that the non-binding area of the two is less than 2%, so as to meet the requirements of high-power sputtering.
